Our Gallery

Contact Info

Twitter Facebook-f Linkedin-in Instagram

Diamond Heat Spreaders

heat-sink

Specification

  • Length: 10.0 mm
  • Width: 10.0 mm
  • Thickness: 0.5 mm
  • Edges: Laser Cut
  • Edge Features: < 0.2 mm
  • Laser Kerf: 3°
  • Lateral Tolerance: +0.2/-0 mm
  • Side 1, Roughness (Ra): Polished, Ra < 50 nm
  • Side 2, Roughness (Ra): Lapped, Ra < 250 nm
  • Thickness Tolerance: ±0.05 mm

At High Carat Semicon, we recognize that each project is unique, and we are dedicated to customizing our products to meet your precise requirements. Whether it’s size, technical specifications, or any other aspect, we tailor our solutions to perfectly align with your needs. Reach out to us today to discuss your project and find the ideal solution designed just for you.

Overview of Diamond Heat Spreaders

What are Diamond Heat Spreaders?

Diamond heat spreaders are engineered to provide exceptional thermal management for electronic devices by effectively distributing heat across components. Leveraging diamond’s superior thermal conductivity, our heat spreaders deliver the perfect solution for high-performance and high-reliability applications, ensuring optimal operation and prolonged longevity of your devices. At High Carat Semicon, we offer thermal solutions that enhance performance while maintaining the highest standards of efficiency and reliability.

Key Benefits

Superior Thermal Conductivity Diamond’s unmatched ability to conduct heat ensures that thermal loads are spread efficiently, reducing the risk of overheating and improving device performance.
Enhanced Device Longevity By evenly distributing heat, diamond heat spreaders help extend the operational life of electronic components, minimizing thermal damage.
Improved Performance Stability The use of diamond heat spreaders ensures that devices operate at optimal temperatures, maintaining performance stability even under high-power conditions.
Low Thermal Expansion Diamond’s low coefficient of thermal expansion minimizes stress on components caused by temperature fluctuations, reducing the risk of material fatigue or failure.